As the use of thermal materials increases in applications such as LED lighting, medical device, TV LCD panel, power supply, and low-energy lamp ballasts, new formulas will emerge offering greater thermal conductivity in addition to outstanding wet-out characteristics and bondline thickness. A key learning task facing electronic manufacturers today is the integration of precision automated dispensing of gap fillers in high-speed inline production. This challenge is best addressed early, as this emerging class of thermal materials should soon become the norm throughout the electronic industry’s most important sectors.