TSP-AS series are high deflection and hybrid version of electromagnetic absorber and thermal interface material. It has good elasticity and compressibility, and excellent operation property. It can be used between integrated circuits, heat sink, other thermal conductive components and metal chassis, which can not only solve the problem of thermal conduction, but also can suppress EMI problems on circuits. It has a broad application range in the era of microwave transmission.

• Good EMI suppression

• Automotive electronics

• 5G Base Station

· 1-side / 2-side adhesive lamination

· Available in sheet or precut finished parts

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Check List of Reliability Test Report for TSP150AS, TSP200AS, TSP300AS Series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

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