TSP17IS is an electrically insulating and thermal conductive foil which is an optimised thermal coupling between  electronic packages and heatsinks. The  material is characterised by its very high dielectric properties. The fiberglass reinforcement is required for an outstanding mechanical stability and cut-through resistance as well as easy handling.

• Easy for die cut and assembly

• Memory & Power Modules

· Telecommunication

· Power diodes or  AC/DC converters

· Medical Electronics

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Check List of Reliability Test Report for TSP10TG, 20TG, 30TG, 50TG Series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

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