TSP15PI High Insulation Thermal Pad

FEATURES & BENEFITS
·   Thermal conductivity 1.5 W/m.K
·   Polyimide film reinforced for meeting higher insulation
·   Conformable, low hardness
·   Abrasion resistance

TSP1525PI is an ultra-soft thermal gap pads laminating with polyimide film to improve its physical and electrical isolation properties. This is especially designed for applications where one-side tacky is required and higher insulation is expected as well. With lamination of the kapton film, the minimum thickness can be obtained as lowest as 0.15mm, which is the best solution as for accomodate with miniature design of electronic devices for saving space and have lighter weight.

FEATURES & BENEFITS

• Thermal conductivity 1.5 W/m.K

• Polyimide film reinforced for meeting higher insulation

• Conformable, low hardness

• Abrasion resistance

Typical Applications

Power Modules/Supply
Led Lighting, LCD TV, Telecom device.
Network Router/Adapter
Cooling Module, Thermal module
Vehicle-intelligence Terminal

Avalable Options

Standard sheet size: 18"x18" or 18"x9"
1-side adhesive lamination
Available in sheet / roll or precut finished parts

Check List of Reliability Test Report for TSP15PI series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

Certification:

High Thermal Conductivity Heat Conductive Silicon Adhesive Electrical Insulating Pad

Strong Logistics System:

High Thermal Conductivity Heat Conductive Silicon Adhesive Electrical Insulating Pad