TSP-P1 series is special designed for use in high  performance devices requiring minimal thermal resistance  for maximum thermal performance and component reliability.  It requires no cure cycle and can be readily re-worked. This  compliant material requires low compression force to  conform over irregular interfaces and can be applied to  single devices with minimum bond-line thickness as well as  to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal  stability and reliable performance than greases.

• Operates at almost zero pressure

• For minimal gaps at low BLT

• RDRAMs memory modules

Part No. Code:

Check List of Reliability Test Report for TSP35P1, 60P1, 80P1 One-part  Series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

Certification:

Strong Logistics System: