TSP12US, TSP15US Ultra Soft Compliant Thermal Pad

FEATURES & BENEFITS
·   Thermal conductivity 1.2~1.5 W/m.K
·   Highly conformable, low hardness
·   “Gel-like” modulus
·   Electrically isolating
·   Decreased strain
·   Enhanced puncture, shear and tear resistant

TSP-US series are Ultra-Soft, fiberglass reinforced, freestanding thermal gap pads that is supplied with rubber-coated fiberglass carrier allowing for ease of handling. With its ultra-low softness and superior conformability to any rough surface or irregular structures, it can alleviate the compression on components and minimize its contact resistance. In addition, this fiberglass carrier strengthen its mechanical performance, like abrasion, punch-resistance etc.

FEATURES & BENEFITS

• Thermal conductivity 1.2~1.5 W/m.K

• Highly conformable, low hardness

• “Gel-like” modulus

• Electrically isolating

• Decreased strain

• Enhanced puncture, shear and tear resistant

Typical Applications

Telecommunications
Computer and peripherals
Power conversion
Between heat-generating semiconductors or magnetic components and a heat sink
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader

Avalable Options

Standard sheet size: 18"x18" or 18"x9"
1-side / 2-side adhesive lamination
Available in sheet / roll or precut finished parts
PI fim / fiberglass carriers are optional

Configurations Available:

Sheet size:200 x 400mm, 350x350mm , individual parts available

Check List of Reliability Test Report for TSP12US, TSP15US series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

Certification:

High Thermal Conductivity Heat Conductive Silicon Adhesive Electrical Insulating Pad

Strong Logistics System:

High Thermal Conductivity Heat Conductive Silicon Adhesive Electrical Insulating Pad