TSP-NS series is a high-performance, best-compliant silicone free  thermal interface material. By combining extremely high thermal  conductivity with exceptional wetting characteristics, these  materials provides low thermal resistance between heat source  component and heat dissipation part or housing. This makes it  well-suited for applications where silicone based pads are  traditionally used as well as those applications which are  silicone sensitive, especially in the optical industry.

FEATURES & BENEFITS

• Ultra soft ad great elongation

• Electrical insulation

• In compliant with UL94 V-0

Typical Applications

• Automotive Electronic Control Units (ECU's)
• Surveillance cameras
• Memory & Power Modules
• Microprocessors / Graphics Processors
• Flat Panel Displays & Consumer Electronics

Avalable Options

• Standard sheet size: 18"x18" or 18"x9"
• 1-side / 2-side adhesive lamination
• Available in sheet / roll or precut finished parts

Remarks:(1）The hardness is read after 30s.

Check List of Reliability Test Report for TSP30 Series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

Certification:

Strong Logistics System: