TSP80 series is very soft silicone gap pads filled with thermally conductive ceramic fillersfor excellent thermal conductivity, superior elasticity and high dielectric strength. They meet the highest requirements regarding thermal transfer. Total thermal transfer resistance is minimized by this material. Both films are self-adhesive on both sides. With unrivalled low softness in 5 Shore 00, it can optimize the thermal performance extraordinary for stress-sensitive applications.

FEATURES & BENEFITS

• Easy mounting through self tackiness

• One or two-side self-tacky

Typical Applications

• High end solution
• Control boards
• BGA applications
• hard disc drives

Avalable Options

• Standard sheet size: 18"x18" or 18"x9"
• 1-side / 2-side adhesive lamination
• Available in sheet / roll or precut finished parts
• Others upon requests

Remarks:(1）The hardness is read after 30s.

Check List of Reliability Test Report for TSP80 Premium Series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

Certification:

Strong Logistics System: