This advanced type of thermal pad series is designed to unit very high thermal conductivity and ultra-low modulus to meet the demands of next-generation telecom and data centre applications.With power densities and thermal loads increasing while devices continue to reduce in space and structures, heat dissipation and low assembly stress is required for optimal performance and reliability. With these options, you can get excellent wet out at the interface even on rough or irregular surfaces, delivering optimized thermal transfer and long-term reliability in any environment conditions.

FEATURES & BENEFITS

• Extraordinary chemical resistance and long_x0002_term stability

• Easy mounting through self tackiness

• One or two-side self-tacky

Typical Applications

• Wireless control devices
• Telecom devices
• Medical applications
• Aerospace, automotives application
• Household devices, cooling modules

Avalable Options

• Standard sheet size: 18"x18" or 18"x9"
• 1-side / 2-side adhesive lamination
• Available in sheet / roll or precut finished parts
• Others upon requests

Remarks:(1）The hardness is read after 30s.

Check List of Reliability Test Report for TSP30 Series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

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