TSP50 series soft gap pad are ultra soft thermal interface gap fillers with great thermal performance and high compliance. The material yields extremely soft characteristics while maintaining elasticity and conformability. The Inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. It is ideal for use to fill gaps between high-power, heat-generating components and related heat sinks, boards or chassis.
• Super Soft and compliant
Remarks:(1）The hardness is read after 30s.
Check List of Reliability Test Report for TSP50LV, TSP80LV series is available after your request
Below info will be helpful for your right application
How to transfer or dissipate the heat from the heat-generating components to heat sinks?
How To Select the Right Thermal Interface Materials for your new application?
Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.
Certification:
Strong Logistics System:
• Thermal conductivity 2~8.0 W/m·K • Non oil-bleed • Ultra soft ad great elongation • Electrical insulation • In compliant with UL94 V-0
FEATURES & BENEFITS • Thermal conductivity 10~15.0 W/m·K • Operates at low pressure • Extraordinary chemical resistance and long_x0002_term stability • Easy mounting through self tackiness • One or two-side self-tacky
FEATURES & BENEFITS • Thermal conductivity 8.0 W/m·K • Operates at low pressure • Extraordinary chemical resistance and long-term stability • Easy mounting through self tackiness • One or two-side self-tacky
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