TSP22 series has a super-fine filler mixture that gives it a low-modulus characteristic which maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.

FEATURES & BENEFITS

• Low volatile of siloxane for silicone sensitive appliations

Typical Applications

• Computer and peripherals; between CPU and heat spreader
• Telecommunications
• Heat pipe assemblies
• RDRAM™ memory modules
• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader

Avalable Options

• Standard sheet size: 18"x18" or 18"x9"
• 1-side / 2-side adhesive lamination
• Available in sheet / roll or precut finished parts
• PI fim / fiberglass carriers are optional

Remarks:(1）The hardness is read after 30s.

Check List of Reliability Test Report for TSP22 Series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

Certification:

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