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TSP28 Series Thermal Pad

TSP28 Series Thermal Pad
FEATURES & BENEFITS
• Thermal conductivity 2.8W/m·K
• Highly conformable, low hardness
• low outgassing
• Available with adhesive on one or both sides
FEATURES & BENEFITS
• Thermal conductivity 2.8W/m·K
• Highly conformable, low hardness
• low outgassing
• Available with adhesive on one or both sides
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TSP28 series offers outstanding thermal conductivity, which is achieved by a specially filled silicone elastomer. The good electrical insulation properties are thereby retained. On request, these pads can also be supplied with fiberglass reinforcement and with or without adhesive coating. The excellent thermal resistance of this thermal gap pad enables the optimum heat transfer to the heat sink or other cooling modules.



FEATURES & BENEFITS

• Thermal conductivity 2.8W/m·K
• Highly conformable, low hardness
• low outgassing
• Available with adhesive on one or both sides


Typical Applications


Avalable Options








Remarks:(1)The hardness is read after 30s.







Check List of Reliability Test Report for TSP15LV, TSP22LV, TSP30LV  series is available after your request


High Thermal Conductivity Heat Conductive Silicon Adhesive Electrical Insulating Pad

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.



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High Thermal Conductivity Heat Conductive Silicon Adhesive Electrical Insulating Pad


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High Thermal Conductivity Heat Conductive Silicon Adhesive Electrical Insulating Pad







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