TSP28 series offers outstanding thermal conductivity, which is achieved by a specially filled silicone elastomer. The good electrical insulation properties are thereby retained. On request, these pads can also be supplied with fiberglass reinforcement and with or without adhesive coating. The excellent thermal resistance of this thermal gap pad enables the optimum heat transfer to the heat sink or other cooling modules.
Remarks:(1)The hardness is read after 30s.
Check List of Reliability Test Report for TSP15LV, TSP22LV, TSP30LV series is available after your request
Below info will be helpful for your right application
How to transfer or dissipate the heat from the heat-generating components to heat sinks?
How To Select the Right Thermal Interface Materials for your new application?
Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.
Certification:
Strong Logistics System: