This TSP30XX series is a soft and compliant thermally conductive thermal gap pad with a thermal conductivity of 3.0W/m.K. The material offers good thermal performance at low pressure based on its low-modulus resin formulation. The innovated material is ideal for applications requiring low stress on components and PCBs in assembly.

They are supplied with natural tacky on both sides and can save your time and cost for laminating with additional PSA on surfaces which will impact severely on its thermal impedance.

FEATURES & BENEFITS

• Optional for adding fiberglass carrier to improve its tear resistance

Typical Applications

• Power electronics DC/DC
• Mass storage devices
• Graphics card/processor/ASIC
• Wireline/wireless communications hardware
• Automotive engine/transmission controls

Avalable Options

• Standard sheet size: 18"x18" or 18"x9"
• 1-side / 2-side adhesive lamination
• Available in sheet / roll or precut finished parts
• PI fim / fiberglass carriers are optional

Remarks:(1）The hardness is read after 30s.

Check List of Reliability Test Report for TSP30 Series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

Certification:

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