TSP50 series soft gap pad are ultra soft thermal  interface gap fillers with great thermal performance and high  compliance, and optional reinforced with fiberglass. The Inherent  natural tack on both sides assists in application and allows the  product to effectively fill air gaps, enhancing the overall thermal  performance. It is ideal for use to fill gaps between high-power,  heat-generating components and related heat sinks, boards or  chassis.

FEATURES & BENEFITS

• Naturally tacky & re-workable

• Super Softand compliant

Typical Applications

• Power electronics DC/DC
• Mass storage devices
• Graphics card/processor/ASIC
• Wireline/wireless communications hardware
• Automotive engine/transmission controls

Avalable Options

• Standard sheet size: 18"x18" or 18"x9"
• 1-side / 2-side adhesive lamination
• Available in sheet / roll or precut finished parts
• PI fim / fiberglass carriers are optional

Remarks:(1）The hardness is read after 30s.

Check List of Reliability Test Report for TSP30 Series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

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