TSP60 series is a silicone thermal pad filled with super fine alumina oxide fillers for excellent thermal conductivity, and optional reinforced with fiberglass. Its very soft texture adapts superbly to the contact surfaces so that thermal contact resistance and total thermal transfer resistance are reduced to a minimum. It meets the highest technical standards for interface materials.

FEATURES & BENEFITS

•Ease of mounting

•One or two-side natural tacky

Typical Applications

• Between heat-generation Conponment and and heatsink.
• Automotive engine control, Graphices Cards, Telecom device.
• Wireless Hub,Military equipment, power supply.
• Cooling Module, Thermal module.
• Telecommunication Hardware

Avalable Options

• Standard sheet size: 18"x18" or 18"x9"
• 1-side / 2-side adhesive lamination
• Available in sheet / roll or precut finished parts
• PI fim / fiberglass carriers are optional

Remarks:(1）The hardness is read after 30s.

Check List of Reliability Test Report for TSP30 Series is available after your request

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in IBH Technology.

Certification:

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