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Thermal Management for Electronic Devices
Release：IBH Advance Material Technology
Data：2022/03/17
Effective thermal management is key to ensuring consistent long-term performance and reliability in electronic devices. With an increasing variety of electronic applications demanding smaller packaging, higher power, and lower cost, the need for innovative high performance, low cost thermal solutions continues to grow.
Thermal interface materials with unique characteristics are designed to improve overall thermal performance and reliability for thermal engineers. There are many pad-form solutions available on the market, designing, documenting, shipping, storing, managing and assembling a multitude of die-cut parts in varying sizes.
Please speak to one of our Application Engineers about sampling IBH’s TCP series and put it on the top of your testing list for your new generation of flip-chip devices.
Thermal interface materials with unique characteristics are designed to improve overall thermal performance and reliability for thermal engineers. There are many pad-form solutions available on the market, designing, documenting, shipping, storing, managing and assembling a multitude of die-cut parts in varying sizes.
Please speak to one of our Application Engineers about sampling IBH’s TCP series and put it on the top of your testing list for your new generation of flip-chip devices.
