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IBH Latest Thermal Product Gap Pad TSP300
Release：IBH Advance Material Technology
Data：2022/03/16
IBH is proud to introduce its latest product Gap Pad TSP300, The new high-compliance Gap Pad TCP300 utilizes a low-modulus resin formulation and filler package to provide exceptional performance at low pressures. The thermal material is well suited for high performance applications requiring low stress on components during assembly. This highly conformable silicone-based material has elastic properties that provide low stress, superior wet-out characteristics and maximum interface adhesion.
Gap Pad TSP300 provide the thermal pathway for transferring heat from components to heat sinks. At one time, most TIMs were simple, homogenous pads filled with thermally conductive fillers. But increasing power levels of processors and other components present a continuous need for improved thermal material performance. Today, a much wider range of high thermal conductivity thermal pads is available from IBH.
Gap Pad TSP300 provide the thermal pathway for transferring heat from components to heat sinks. At one time, most TIMs were simple, homogenous pads filled with thermally conductive fillers. But increasing power levels of processors and other components present a continuous need for improved thermal material performance. Today, a much wider range of high thermal conductivity thermal pads is available from IBH.
