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New Generation Of High Compliance Thermal Material Pad
Release：IBH Advance Material Technology
Data：2022/03/16
The IBH Technology is proud to introduce its latest product in our Thermal Conductive Pad family – TSP600. The new high-compliance TSP600 utilizes a low-modulus resin formulation and filler package to provide exceptional performance at low pressures. The thermal pad material is well suited for high performance applications requiring low stress on components during assembly. This highly conformable silicone-based material has elastic properties that provide low stress, superior wet-out characteristics and maximum interface adhesion.
TSP600 is fiberglass reinforced to enhance material handling, shear, and tear resistance. In addition, both sides have natural tack which will minimize shifting of the material during assembly. The top side has minimal inherent natural tack which provides a stable release characteristic for clean and easy handling during assembly, leading to significant processing cost savings and throughput. Typical applications for TSP600 include computers and peripherals, power conversion, telecommunications and applications with any heat-generating semiconductor and heat sink.
