IBH Advance Material Technology

Thermal Pad TSP6000 series have a high conductivity of 6.0 W/m*K and is available in 0.5 mm to 10 mm thicknesses.

Standard Silicone Base Thermal Pads Thermal Pad TSP6000 series have a high conductivity of 6.0 W/m*K and is available in 0.5 mm to 10 mm thicknesses.Thermal interface materials or thermal pads are space saving solutions to managing heat. They are used to fill the gaps between heat sinks and microprocessors. Even when not seen by the naked eye, microscopic air bubbles can be present in this space between the components, which when heated can harm the long term productivity and lifespan of the entire product. IBH’s thermal pad series are the solutions that prevent these air gaps from harming your system’s components while maintaining excellent thermal conductivity.