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TSP12US 1.2 W/m.K|TSP10 1.0~1.5 W/m.K|TSP22 2.2W/m.K|TSP28 2.8 W/m.K|TSP30 3.0W/m.K|TSP35 3.5W/m.K|TSP50 5.0W/m.K|TSP60 6.0W/m.K|TSP80 8.0W/m.K|TSP100 10-15W/m.K|TSP3060NS Non-silicone 2~10.0W/m·K

TSP12US, TSP15US Ultra Soft Compliant Thermal Pad

FEATURES & BENEFITS
·   Thermal conductivity 1.2~1.5 W/m.K
·   Highly conformable, low hardness
·   “Gel-like” modulus
·   Electrically isolating
·   Decreased strain
·   Enhanced puncture, shear and tear resistant

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TSP12US, TSP15US Ultra Soft Compliant Thermal Pad

FEATURES & BENEFITS
·   Thermal conductivity 1.2~1.5 W/m.K
·   Highly conformable, low hardness
·   “Gel-like” modulus
·   Electrically isolating
·   Decreased strain
·   Enhanced puncture, shear and tear resistant

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